APPLICATIONS -- Low-k

The dielectric constant (k) of the interlayer dielectric film is an increasingly critical parameter as device dimensions shrink.  The Standard Forward/Reverse Bias measurement module of SSM’s Capacitance-Voltage (C-V) systems can be used to measure k of these films for process development and production control. SSM’s metrology systems perform these measurements rapidly, and do not require deposition of a metal or
poly-Si gate.

SSM Hg probe CV systems are used with both spin-on-dielectric and CVD films.  Most commercially available low-k materials have been successfully measured.

SSM NeoMetriK™ in-line electrical metrology systems for Cu/low-K process flow measures the dielectric constant of low-K stacks, monitors sidewall damage from etch and cleaning processes, and interline capacitance of femto-Farad test structures after metalization.

To request information or technical papers click here or write to us at info@ssm-inc.com.