The SSM 5130 fully automatic mapping system provides a variety of electrical characterization measurements for non-patterned wafers used in epitaxial silicon production and front-end semiconductor processing. Wafers are robotically loaded onto the mapping stage from a cassette or opened FOUP. The test wafer moves to each site specified in a pre-programmed map as electrical characterization tests are made. The system stores test data and reports it in a variety of formats.  The SSM 530 system has the same abilities, however it does not have a robot.

The SSM 5130 and 530 eliminate the need for costly metal and poly deposition processes by using a pneumatically controlled, non-damaging probe design and a top-side mercury contact. With separate probe and chuck vacuum lines, the system features an extremely stable contact area and uses only a small quantity of mercury to make highly repeatable measurements for process development and process monitoring applications.

Typical SSM 5130 and 530 applications
• EPI resistivity
• Low-k dielectric constant
• Oxide integrity

SSM 5130 and 530 features
• Wafer diameter from 200 mm to 300 mm
• Single-site and multiple-site maps
• Automatic face-up loading prevents wafer damage
• Precision pressure regulators for Hg contact
• PROCAP software provides a full suite of measurements

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